TSMC CoWoS Advanced Packaging Capacity Continues Expansion, AI Chip Demand Drives Packaging Technology Upgrade

Advanced Packaging Demand Explosive Growth

With the explosive growth of AI chip and high-performance computing demand, advanced packaging technology has become one of the key bottlenecks in the semiconductor industry. TSMC CoWoS packaging capacity remains in short supply in 2025, with the company planning to increase monthly capacity to over 40,000 wafers to meet surging orders from customers like NVIDIA and AMD.

CoWoS Technology Evolution Roadmap

TSMC CoWoS technology has evolved from CoWoS-S to CoWoS-R and CoWoS-L, with silicon interposer area continuously expanding to support more HBM memory stacking and larger chip integration. The latest generation CoWoS-L technology can support chip packaging exceeding 4x reticle size, providing unprecedented integration capability for AI chips.

Packaging Industry Chain Accelerates Expansion

ASE, Amkor, JCET and other packaging leaders are also actively expanding advanced packaging capacity. ASE advanced packaging facilities in Taiwan continue to expand, and JCET has significantly improved its advanced packaging technology capabilities after acquiring STATS ChipPAC. The global packaging industry chain is accelerating its transition to advanced packaging.